Packaging, Test & Assembly Process Overview

In the fast-paced world of technology, the 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴, 𝗧𝗲𝘀𝘁, 𝗮𝗻𝗱 𝗔𝘀𝘀𝗲𝗺𝗯𝗹𝘆 𝗽𝗿𝗼𝗰𝗲𝘀𝘀 is critical in ensuring that semiconductor chips are durable, reliable, and ready to power devices like smartphones, IoT systems, and industrial equipment.
Here’s an overview of this essential stage of semiconductor manufacturing:
𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴
Packaging protects chips from environmental hazards, helps manage heat dissipation, and enables electrical connections. Key techniques include:
• 𝗪𝗶𝗿𝗲 𝗕𝗼𝗻𝗱𝗶𝗻𝗴: Thin wires that connect chip pads to external pins.
• 𝗙𝗹𝗶𝗽-𝗖𝗵𝗶𝗽 𝗕𝗼𝗻𝗱𝗶𝗻𝗴: Direct solder bump connections for higher performance.
• 𝗦𝘆𝘀𝘁𝗲𝗺-𝗶𝗻-𝗣𝗮𝗰𝗸𝗮𝗴𝗲 (𝗦𝗶𝗣): Compact packages integrating multiple components for multi-functional use.
𝗔𝘀𝘀𝗲𝗺𝗯𝗹𝘆
Assembly integrates components into complete, functional packages, ensuring they’re ready for real-world applications. Core steps include:
• 𝗗𝗶𝗲 𝗔𝘁𝘁𝗮𝗰𝗵: Bonding the semiconductor die accurately.
• 𝗘𝗻𝗰𝗮𝗽𝘀𝘂𝗹𝗮𝘁𝗶𝗼𝗻: Protecting the die and connections.
• 𝗠𝗮𝗿𝗸𝗶𝗻𝗴 𝗮𝗻𝗱 𝗦𝗶𝗻𝗴𝘂𝗹𝗮𝘁𝗶𝗼𝗻: Engraving identification marks and separating individual units.
𝗧𝗲𝘀𝘁𝗶𝗻𝗴
Testing ensures that each chip meets strict quality standards and performs as intended. This process involves:
• 𝗪𝗮𝗳𝗲𝗿 𝗧𝗲𝘀𝘁𝗶𝗻𝗴: Screening wafers before they are diced to detect early defects.
• 𝗙𝗶𝗻𝗮𝗹 𝗧𝗲𝘀𝘁𝗶𝗻𝗴: Rigorous electrical, thermal, and mechanical tests to verify real-world functionality.
𝗧𝗼𝗽 𝗦𝗲𝗶𝗸𝗼: 𝗣𝗿𝗲𝗰𝗶𝘀𝗶𝗼𝗻 𝗮𝘁 𝗘𝘃𝗲𝗿𝘆 𝗦𝘁𝗮𝗴𝗲
At Top Seiko, we provide high-precision manufacturing solutions tailored to the unique challenges of the Packaging, Test, and Assembly processes.
Our expertise includes custom precision parts, high-durability components, and reliable tools that support rigorous testing protocols.
𝗣𝗮𝗿𝘁𝗻𝗲𝗿 𝘄𝗶𝘁𝗵 𝘂𝘀 𝘁𝗼 𝗺𝗲𝗲𝘁 𝘁𝗵𝗲 𝗱𝗲𝗺𝗮𝗻𝗱𝘀 𝗼𝗳 𝗺𝗼𝗱𝗲𝗿𝗻 𝘀𝗲𝗺𝗶𝗰𝗼𝗻𝗱𝘂𝗰𝘁𝗼𝗿 𝗺𝗮𝗻𝘂𝗳𝗮𝗰𝘁𝘂𝗿𝗶𝗻𝗴.
𝗖𝗼𝗻𝘁𝗮𝗰𝘁 𝘂𝘀 𝘁𝗼𝗱𝗮𝘆 𝘁𝗼 𝗲𝘅𝗽𝗹𝗼𝗿𝗲 𝗵𝗼𝘄 𝘄𝗲 𝗰𝗮𝗻 𝗵𝗲𝗹𝗽 𝘆𝗼𝘂 𝗮𝗰𝗵𝗶𝗲𝘃𝗲 𝗼𝘂𝘁𝘀𝘁𝗮𝗻𝗱𝗶𝗻𝗴 𝗿𝗲𝘀𝘂𝗹𝘁𝘀 !