Deep Hole Drilling – Top Seiko
Deep Hole Drilling on MMC
MMC‘s exceptional hardness poses a formidable challenge to conventional machining techniques.
Our φ0.8 x 300mm deep hole achievement signifies a pivotal triumph over this obstacle.
Through meticulous planning, cutting-edge tooling, and a scrupulous control of machining parameters, we’ve navigated the intricate SiSiC matrix, demonstrating an exceptional ability to manipulate this material at a depth that was hitherto considered exceptionally challenging.
MMC is a composite material composed of Si and SiC, boasting various superior properties including high thermal conductivity, excellent thermal resistance, and exceptional hardness.
Its has garnered significant attention, particularly within the semiconductor field.
We welcome any inquiries you may have and are committed to providing swift and comprehensive assistance.
Your satisfaction is our priority, and we look forward to the opportunity to exceed your expectations.
Let’s aim for the TOP together!