Enhancing Semiconductor Manufacturing with Advanced Vacuum Chucks

In recent years, the semiconductor industry has seen remarkable advancements in chip performance, mainly due to circuit miniaturization and layering.
Among these innovations, 3D packaging and hybrid bonding stand out as two leading technologies in the middle-end semiconductor manufacturing process.

At Top Seiko, we provide high-quality vacuum chucks made from various materials, specifically designed for these cutting-edge processes.
We serve a wide range of customers, offering vacuum chucks that cater to their unique needs.

For instance, when you need to quickly transfer heat, require a rigid vacuum chuck, or want to match the thermal expansion coefficient of silicon wafers, we recommend SiC (Silicon Carbide) or SiC-based composite materials (MMC). These materials provide high thermal conductivity and rigidity, ensuring optimal performance in demanding conditions.

On the other hand, if you need to insulate against heat, prevent expansion when heated, or require transparency for observing the substrate, we propose quartz glass. This material offers excellent insulation properties, minimal thermal expansion, and visibility for inspecting the wafer from the opposite side.

Additionally, the top surface of the vacuum chuck, which holds the wafer or substrate, must achieve precise flatness.
At Top Seiko, we ensure this by using NAGASE’s ultra-precision grinding technology, achieving a flatness of 0.003 mm.
In some cases, we can meet even stricter requirements.

Moreover, we offer a range of additional services such as heli-coil insertion, coating, and polishing to further customize your vacuum chucks.

Contact us today to learn how we can support you in reaching your technological goals !

Further Reading and Resources:

For more detailed information on high-performance materials and their applications, visit the Top Seiko News Blog.